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SON8-0.65-BA227
Price: 2.52€
Adapter TO DIP for SON8 packages with 0.65mm pitch
Photo shows top and bottom views.
Bottom copper have a small prototyping area with a matrix of 3x2 pads.
Has also a ground plane, with a connection pad.
Dimensions: 11 x 11 x 1.5 mm
Distance between connector rows: 7.6 mm
Bottom copper have a small prototyping area with a matrix of 3x2 pads.
Has also a ground plane, with a connection pad.
Dimensions: 11 x 11 x 1.5 mm
Distance between connector rows: 7.6 mm
Our reference is: BA227
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Breadboard-adapters © 2017