LFCSP10 3X3 mm 0.50mm pitch to DIP adapter board
Photo with top and bottom views.
Central pad is connected with vias to bottom copper for better heat transfer and can be grounded if necessary
Bottom copper has a SMD prototyping area and a small grounding plane.
Dimensions: 14 x 11 mm
Distance between rows: 7.6 mm
Our reference: BA119