MLF10 / TQFN10 to DIP 3x3 mm 0.50mm pitch, adapter board
Photo with top and bottom views.
Bottom copper have an extra smd prototyping area and a grounding plane.
The interconnections of the 6 pads matrix are easy to remove as needed, with a blade.
Dimensions: 14 x 11 x 1,5 mm
Distance between rows: 7.6 mm
Our reference: BA118