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LFCSP8-3X3-0.50-BA435
Price: 2.74€
LFCSP8 3X3 mm 0.50 mm pitch, TO DIP adapter board
A matrix of small vias allows better heat transfer between top and bottom layers
Bottom copper works as a small heatsink.
Dimensions: 11 x 11 x 1.5 mm
Distance between connector rows: 7.6 mm
Bottom copper works as a small heatsink.
Dimensions: 11 x 11 x 1.5 mm
Distance between connector rows: 7.6 mm
Our reference: BA435
A print of this pdf in 1:1 scale can be used to verify if this adapter fits with your chip:
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Breadboard-adapters © 2021