DFN10 to DIP adapter board 3X3mm 0.50mm pitch
Photo with top and bottom views.
Bottom copper have a small smd prototyping area with 6 pads and a grounding plane under the LGA10.
The interconnections of the 6 pads matrix are easy to remove as needed, with a blade.
Dimensions: 14 x 11 x 1.5 mm
Distance between rows: 7.6 mm
Our reference: BA117