- SMD / SMT package: QFN-14 3.5 X 3.5 mm 0.50 mm pitch. - Adapter board to DIP for breadboard prototyping. - PCB has a solder mask layer to minimise the formation of solder bridges during soldering. - For connectors with 0.1 inch pitch, not included. - On bottom copper, this adapter has a proto area of 2 x 20 pads interconnected with tracks, (easy to remove as required), - A ground plane under the chip is available, with one pad connection.