| Surface mount adapter for devices with
LFCSP-8 packaging, in FR4 quality pcb with gold plated pads |
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| Dimensions |
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| LFCSP-8 package
dimensions (mm) |
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min |
max |
| D |
2.9 |
3.1 |
| E |
2.9 |
3.1 |
| HE |
2.9 |
3.1 |
| e
(pitch) |
0.5 |
0.5 |
| b |
0.17 |
0.33 |
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| Photo of LFCSP-8 to DIP-8 adapter board |
CAD view of our
breakout pcb adapter for LFCSP8 . Adapter board and
simulated package are represented in the same scale.
Works as a chip to DIP-8 converter. |
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| PCB type: |
FR4 plated through |
| PCB dimensions: |
11 x 11 x 1,5 mm |
| For connectors (not included) with
pitch: |
2,54 mm |
| Distance between rows |
7,6 mm |
| Bottom copper as ground plane / heatsink:
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yes |
| Solder mask isolation layer: |
yes |
| Copper Surface: |
gold plated |
| ROHS |
compliant |
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| Bottom copper layer is available as ground
to minimize noise |
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Links examples for LFCSP8 package
www.analog.com/static/imported-files/application_notes/AN-772.pdf
http://www.analog.com/en/technical-library/packages/csp-chip-scale-package/lfcsp/index.html
LFCSP means Leadframe Chip Scale Package, 0.5
and 0.8mm pitch
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